S/N;Parameter;Value;Notes

1;Input Voltage Range;24 – 32 VDC;Nominal 28 V 2;Rated Power;225W;derating curve starts at +70 °C 3;Output Voltage Accuracy;≤±1%;Under nominal load, nominal input, and room temp 4;Load regulation;≤ ±0.1%;when load current varies from no-load to full-load 5;Line regulation;≤ ±0.1%;over input range 24–32 V 6;Output ripple (peak-to-peak);≤100 mV p-p;0.1 Hz–100 MHz.Measured at steady load. Bandwidth: 20 MHz 7;Overshoot;<5% during ransient;no sustained ringing; 8;Start-up time;< 300 ms;VIN applied to output within regulation ±1% 9;Hold-up time;≥ 10 ms;from loss of VIN to output voltage 10;Output 1;+28V/2.5A;independent power system 11;Output 2;+28V/5A;independent power system 12;Efficiency;≥ 90%;For 70% to 100% load 13;over-temperature protection;90ºC(min).125ºC(max);Power supply should work at full for 1 hour at 70ºC 14;Output overcurrent protection;1) 4.6 ② 7.1U 2) 6.3 ② 9.5;used as a test indicator 15;Output overvoltage protection;33V(min).36V(max); 16;Load 2 output delay;>50mS

Parameter;Value

Dimensions;180x140x30 mm Weight;≤ 700 g Mounting;Three holes (4mm taped.10mm deep) on edge of cavity

Pin definition of (15pin micro-D female) Input connector

S/N;Purpose;Function 1-8;+28V ± 4VDC;Power In 9-15;+28V GND

Pin definition of (9pin micro-D female) Output 1 connector

S/N;Purpose;Function 1-5;+28V/2.5A;Power Out 6-9;+28V GND

Pin definition of (15pin micro-D male) Output 2 connector

S/N;Purpose;Function 1-6;+28V/5A;Power Out 7-10;Power GND 11;RS422 Rx+;Industrial PC to Module 12;RS422 Rx-;Industrial PC to Module 13;RS422 Tx+;Module to Industrial PC 14;RS422 Tx-;Module to Industrial PC 15;Signal GND

- RS422 Port (15pin micro-D male [pin 11 - 15]) - Baud Rate: 9600 bps - Function: Reports voltage and current of both outputs and Switch On/Off Output 1 only

; ;Command 1 AB;A0;OUTPUT 1;XOR Checksum;FA;AA

Byte;Name;Data;Function Byte_1;Frame Header OUTPUT 1 XOR Checksum ;0xAB Byte_2;Frame Header OUTPUT 1 XOR Checksum;0xA0 Byte_3;Frame Header OUTPUT 1 XOR Checksum;0x00;OFF Byte_3;Frame Header OUTPUT 1 XOR Checksum;0xAA;ON Byte_3;Frame Header OUTPUT 1 XOR Checksum;Others;DO NOTHING Byte_4;Frame Header OUTPUT 1 XOR Checksum;--;XOR all bytes of header and data Byte_5;Frame Footer;0xFA Byte_6;Frame Footer;0XAA

; ;Command 2; ;

BB;B0;Health Enquiry;XOR;Checksum;FA;AA

Byte;Name;Data;Function

Byte_1;Frame Header Health Enquiry;0xBB Byte_2;Frame Header Health Enquiry; 0xB0 Byte_3;Frame Header Health Enquiry;0x11 Byte_4;XOR Checksum;--;XOR all bytes of header and data Byte_5;Frame Footer;0xFA Byte_6;Frame Footer;0XAA

BB;B0;Input Voltage;Output Current 1;Output Current 2;XOR Checksum;FA;AA

Byte;Name;Data;Function

Byte_1;Frame Header;0xBB Byte_2;Frame Header;0xB0 Byte_3;Input Voltage;0x1C;Refer to table below Byte_4;Current 1;0xXX;Refer to table below XOR all bytes of header and data Byte_5;Current 2;0xXX;Refer to table below XOR all bytes of header and data Byte_6;XOR Checksum ;--;Refer to table below XOR all bytes of header and data Byte_7;Frame Footer;0xFA Byte_8;Frame Footer ;0XAA

Parameter;Value;Hex 1Byte Value

Input voltage Output Currents;32V;0x20 Input voltage Output Currents;.;. Input voltage Output Currents;28V;0x1C Input voltage Output Currents;.;. Input voltage Output Currents;24V;0x18;. Input voltage Output Currents;0A;0x00 Input voltage Output Currents;0.024;0x01 Input voltage Output Currents;.;. Input voltage Output Currents;.;. Input voltage Output Currents;6A;0xFA ; ; Comments : ; Voltage range depends upon XADC so minimum and maximum could be adjusted as OEM desires Current range and resolution depends upon the current sense amplifier and XADC. So OEM can adjust both as per actual implementation. However we desire a good resolution.

CB;C0;Error Code;XOR Checksum;FA;AA

Byte;Name;Data;Function

Byte_1;Frame Header Error Code;0xCB Byte_2;Frame Header Error Code;0xC0 Byte_3;Frame Header Error Code;--;0x01 (Checksum Error) 0x02 (Invalid Command) 0x03(Parameter Out of Range) Byte_4;XOR Checksum;--;XOR all bytes of header and data Byte_5;Frame Footer;0xFA Byte_6;Frame Footer;0XAA

Temperature tests will be performed at OEM facility. Other qualification tests will be performed at user facility. S/N;Test;Acceptance

1;EMC/EMI;CE102, CS101, CS114, CS115, CS116, CS118, RE102, RS103 2;Low Temperature;-40 ºC for 4hrs 3;High Temperature;+70 ºC for 4hrs 4;Random Vibration;6.06grms/10mins/Axis 5;Endurance vibration;3.60grms, 01hr/X,Y and Z axis 6;Mechanical shock;30g/11ms/saw tooth/Half Sine 7;Linear acceleration;6g/3min 8;Thermal stress cycle;-20 ºC to +60 ºC @ 2 to 3 ºC/min 60min soak time, 2xCycle 9;Thermal shock;-40 ºC to +70 ºC in 1min 10;Low pressure;0.18bar for 15mins(40k ft) 11;Humidity test;60% to 90%, +20 ºC to +70 ºC for 75 hrs 12;Power on Aging;4hrs ON + 0.5hrs OFF (16 Cycles) 13;Isolation resistance;>10MΩ @ 200VDC for 60sec